TECHNOLOGY LICENSING OPPORTUNITY: Electroplated Materials and Array Design for Scintillators
Energy, Department of · ENERGY, DEPARTMENT OF
This notice is not accepting responses (deadline was Feb 10, 2026, 7:00 PM EST).
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- Response deadline
- Feb 10, 2026, 7:00 PM EST
- Posted
- Jan 20, 2026
- Solicitation
- S-133996
- Set-aside
- No Set aside used
- PSC
- GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCHAJ12
- Place of performance
- Los Alamos, NM, USA
- Contracting office
- TRIAD - DOE CONTRACTOR · Columbus · OH
- Source
- SAM.gov · updated May 9, 2026
Description
Modern scintillator grids are essential to radiation detection systems that require high spatial resolution and fast response. However, current grid fabrication methods rely on hazardous chemical etching and produce inconsistent structures that limit performance, scalability, and safety. This capability addresses the limitations of current fabrication methods by eliminating hazardous chemical etching, improving uniformity, and enabling complex geometries at scale. Advantages Enables high-resolution grid fabrication from high-Z metals (e.g., Re, Au, Re/Ni) Avoids toxic and hazardous chemicals associated with traditional etching Supports scalable production of precision-aligned, high-Z scintillator arrays with low material loss Provides micron-level dimensional control and uniformity Compatible with multiple scintillator materials and array configurations, enabling customization for medical, industrial, and defense applications Adaptable to custom geometries for specialized imaging or detection applications Technology Description This technology enables the fabrication of dense, high-resolution scintillator grid arrays with micron-level precision, suitable for advanced radiation detection and imaging applications. The process works by electroplating high-Z metals, such as rhenium (Re), gold (Au), or their alloys, onto a substrate in the shape of the final grid geometry. These electro-formed components are then joined using hot isostatic pressing (HIP) at metal-specific temperatures and pressures to form solid bonded structures. Finally, the substrate is dissolved, leaving behind a free-standing, precision-aligned grid array. This approach eliminates chemical hazards, improves feature uniformity, and supports complex geometries, making it suitable for both small- and large-scale detector production. Market Applications This technology supports next-generation imaging and detection systems where high resolution, precision fabrication, and material efficiency are critical. This process can benefit: Fabricating CT, PET, and SPECT detector arrays for medical imaging Developing radiation detection systems for homeland security or military use Producing NDT imaging systems for aerospace and industrial inspection Supporting nuclear energy monitoring with compact, rugged detection grids Enabling advanced materials R&D for photonic and meta-material applications https://www.lanl.gov/engage/collaboration/feynman-center/tech-and-capability-search/electroplated-scintillators LANL Tech Partnerships: Unlock the Innovative Potential Los Alamos National Laboratory offers a wide range of cutting-edge technologies and capabilities that may provide your company with a competitive edge in the market and unlock the innovative potential that can enhance, refine, and revolutionize your products. LANL�s licensing program focuses on moving inventions developed by our researchers to commercial innovations. Patented and patent pending inventions and copyrighted software are available to existing and start-up companies through exclusive and non-exclusive licensing agreements. For specific discussions, please contact licensing@lanl.gov. Note: This is not a call for external services for the development of this technology. https://www.lanl.gov/engage/collaboration/feynman-center/partner-with-us/licensing-technology https://www.lanl.gov/engage/collaboration/feynman-center/tech-and-capability-search
What similar awards have paid
Real federal awards already on the books in a similar lane — so you can size the opportunity, not guess. This is public history, not a bid price, cost estimate, or prediction that you will win.
Typical award size
$1.19M
Middle of the pack for similar past awards
Most similar awards fall between $250,000 and $1.82M
Who has won work like this
Public awardees in this lane — useful for competitor scan or teaming ideas, not a ranked list of “best” firms.
- 1BATTELLE SAVANNAH RIVER ALLIANCE, LLC1 award$1.32B
- 2LINQUEST CORPORATION3 awards$65.59M
- 3GENERAL ATOMICS2 awards$44.60M
- 4SCIENCE APPLICATIONS INTERNATIONAL CORPORATION1 award$33.41M
- 5MI TECHNICAL SOLUTIONS, INC.3 awards$30.81M
- 6THE KENIFIC GROUP LLC1 award$30.65M
- 7THE LELAND STANFORD JUNIOR UNIVERSITY1 award$25.64M
- 8RIVERSIDE TECHNOLOGY INC1 award$23.28M
Recent examples
A few of the newest similar awards in our index.
- UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATIONSep 30, 2025Department of Veterans Affairs$5,160Source
- BATTELLE MEMORIAL INSTITUTESep 30, 2025Department of Homeland Security$601,162Source
- CAPESYM INCSep 30, 2025Department of Homeland Security$1.19MSource
- BATTELLE SAVANNAH RIVER ALLIANCE, LLCSep 30, 2025Department of Energy$1.90BSource
- MI TECHNICAL SOLUTIONS, INC.Sep 29, 2025General Services Administration$12.60MSource
- MI TECHNICAL SOLUTIONS, INC.Sep 29, 2025General Services Administration$37.46MSource
Drawn from official USAspending contract records in our index. Always confirm requirements on the SAM.gov notice before you bid.
Intelligence only — not legal advice or a guarantee of award. Always verify requirements on the official SAM.gov notice. Past award amounts are public history, not a suggested bid or prediction. Notice ID 863eb8f9b4db4af5a9c982d45f33c9a7.