Wire Bonder Training and Preventative Maintenance
Dept of Defense · DEFENSE MICROELECTRONICS ACTIVITY (DMEA)
This notice is not accepting responses.
Page kept for research and related open opportunities below. For current work in this category, use the related notices or browse hubs.
- Response deadline
- Not listed
- Posted
- Jul 13, 2026
- Solicitation
- 26-6E6
- Set-aside
- None listed
- Place of performance
- CA, USA
- Contracting office
- DEFENSE MICROELECTRONICS ACTIVITY · MCCLELLAN · CA
- Source
- SAM.gov · updated Jul 13, 2026
Description
Preventative Maintenance and Advanced Training for Wire Bonding specific to KnS products.
What similar awards have paid
Real federal awards already on the books in a similar lane — so you can size the opportunity, not guess. This is public history, not a bid price, cost estimate, or prediction that you will win.
Typical award size
$60,750
Middle of the pack for similar past awards
Most similar awards fall between $23,205 and $684,800
Who has won work like this
Public awardees in this lane — useful for competitor scan or teaming ideas, not a ranked list of “best” firms.
- 1RAITH AMERICA INC1 award$8.59M
- 2HEIDELBERG INSTRUMENTS INC.1 award$4.71M
- 3TYSTAR CORPORATION1 award$2.74M
- 4KLA CORPORATION1 award$1.71M
- 5PLASMA-THERM LLC2 awards$1.71M
- 6SCIA SYSTEMS GMBH1 award$1.50M
- 7EV GROUP INC1 award$748,800
- 8ANGSTROM ENGINEERING INC1 award$684,800
Drawn from official USAspending contract records in our index. Always confirm requirements on the SAM.gov notice before you bid.
Intelligence only — not legal advice or a guarantee of award. Always verify requirements on the official SAM.gov notice. Past award amounts are public history, not a suggested bid or prediction. Notice ID 8b3dbeaea3f944b78bb4eb7d2f14dbcf.