Multiple Award PCB Fab and Assembly BPAs 2026-2030

Description

Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.