CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Commerce, Department of · NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
This notice is not accepting responses (deadline was Mar 9, 2026, 11:00 AM EDT).
Page kept for research and related open opportunities below. For current work in this category, use the related notices or browse hubs.
- Response deadline
- Mar 9, 2026, 11:00 AM EDT
- Posted
- Feb 24, 2026
- Solicitation
- 1333ND26QNB030031
- Set-aside
- None listed
- Place of performance
- Gaithersburg, MD, USA
- Contracting office
- DEPT OF COMMERCE NIST · GAITHERSBURG · MD
- Source
- SAM.gov · updated Jul 5, 2026
Description
Amendment 0001: Amendment changes include the following: The required response date is extended from February 26, 2026 to March 9, 2026 No Statement of work change Questions and Answers: Question1: Is there a cleanroom specification? NIST Response: No. The instrument will be installed in a general purpose lab in the advanced measurement laboratory facility, but not within a cleanroom. Question 2: Are you flexible on the footprint (size/dimension) NIST Response: NIST expects the analytical instrument (source, stages, detectors, and shielded enclosure) to fit within the footprint specified by 10.2. Additional space is available in the lab around the instrument for service access, and for support equipment (including chase space for air compressor/dryer if required, and a work area in the lab for control and analysis PCs). Question 3: Are the devices in JEDEC Trays? NIST Response: Typically no. NIST requires significant flexibility to load samples that are within the size envelope described by specification 5. Samples will include full wafers, coupons (partial wafers), individual or groups of packaged devices, as well as atypical sample geometries. To meet requirement 5.1, vendors must include 5 sample carriers that are compatible with the automated loading system. Carriers supporting a JEDEC tray is only one possible way to meet that requirement. See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.
What similar awards have paid
Real federal awards already on the books in a similar lane — so you can size the opportunity, not guess. This is public history, not a bid price, cost estimate, or prediction that you will win.
Typical award size
$35,219
Middle of the pack for similar past awards
Most similar awards fall between $15,900 and $86,752
Who has won work like this
Public awardees in this lane — useful for competitor scan or teaming ideas, not a ranked list of “best” firms.
- 1SUSS MICROTEC INC1 award$417,621
- 2NORTHROP GRUMMAN SYSTEMS CORPORATION1 award$218,000
- 3MYCRONIC INC1 award$210,000
- 4GPD OPTOELECTRONICS CORP.1 award$156,455
- 5TECHNICAL COMMUNITIES, INC.1 award$136,483
- 6MARKET TECH, INC1 award$86,752
- 7TOPTICA PHOTONICS INC1 award$81,424
- 8HITECH GLOBAL DISTRIBUTION, LLC1 award$68,945
Drawn from official USAspending contract records in our index. Always confirm requirements on the SAM.gov notice before you bid.
Intelligence only — not legal advice or a guarantee of award. Always verify requirements on the official SAM.gov notice. Past award amounts are public history, not a suggested bid or prediction. Notice ID fcad963625ca4b36b09c834176fbc194.