Federal contractor · public award history
SIENNA TECHNOLOGIES, INC.
DBA SIENNA TECHNOLOGIES INC
Parent: SIENNA TECHNOLOGIES, INC. Unique Entity Identifier (UEI)W8VZALJ8J617
- Awards we know about
- 3
- Typical size
- $143,750
- Middle of their public awards
- Dollars on those awards
- $410,500
Most of their awards we can see fall roughly between $133,375 and $143,750.
SAM.gov registration
- Status
- Active
- Purpose of registration
- All awards (Z2)
- Registration expires
- Dec 26, 2026
- Activation date
- Dec 30, 2025
- Primary NAICS (SAM)
- Other Electronic Component Manufacturing334419
Other NAICS on file
Business types (SAM)
Registration fields from the official SAM.gov public entity extract (monthly bulk). Not a substitute for live SAM checks.
Continue contractor research
Use the verified identifiers and public award record to investigate documented incumbents, compare competitors, or identify possible teaming partners. This is a research starting point, not a capability or partner recommendation.
These official USAspending contract records do not rate capability or past performance and do not tell you whether to team or bid.
Awarding agencies
- National Aeronautics and Space Administration (3)
Industries & product codes
Award history
- National Aeronautics and Space Administration$143,750Jul 16, 2025Procurement Instrument Identifier (PIID)80NSSC24PA494All Other Miscellaneous Electrical Equipment and Component Manufacturing335999Combination And Miscellaneous Instruments6695Contract awardUSAspending ↗
HF2C SIC PRESSURE-TEMPERATURE SENSORS PACKAGING
- National Aeronautics and Space Administration$143,750Jul 16, 2025Procurement Instrument Identifier (PIID)80NSSC24PB522Other Electronic Component Manufacturing334419Miscellaneous Fabricated Nonmetallic Materials9390Contract awardUSAspending ↗
DRPA SENSOR CHIPS
- National Aeronautics and Space Administration$123,000Apr 9, 2025Procurement Instrument Identifier (PIID)80NSSC22PA410Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)541715Miscellaneous Fabricated Nonmetallic Materials9390Contract awardUSAspending ↗
PACKAGING OF ON-CHIP INTEGRATED SILICON CARBIDE PRESSURE AND MICRO-TC SENSORS
For research only. This is not legal advice, a past-performance review, or a recommendation to team or bid. Check USAspending and SAM.gov.